نتایج جستجو برای: symmetric thermal stress
تعداد نتایج: 722675 فیلتر نتایج به سال:
This paper presents low cycle fatigue (LCF) life prediction of a coated and uncoated exhaust manifolds. First Solidworks software was used to model the exhaust manifolds. A thermal barrier coating system was applied on the tubes c of the exhaust manifolds, consists of two-layer systems: a ceramic top coat (TC), made of yttria stabilized zirconia (YSZ), ZrO2-8%Y2O3 and also a metallic bond coat ...
A fuel cell is an electro-chemical tool capable of converting chemical energy into electricity. High operating temperature of solid oxide fuel cell, between 700oC to 1000oC, causes thermal stress. Thermal stress causes gas escape, structure variability and cease operation of the SOFC before its lifetime.The purpose of the current paper is to present a method that predicts ...
در این پایان نامه بر مقاله ی an iterative method for the symmetric and skew symmetric solutions of a linear matrix equation axb+cyd =e نوشته ی xingping sheng و guoliang chen، مروری داشته ایم. در این مقاله دو روش تکراری برای حل معادله ی ماتریسی خطی axb+cyd=e ارائه شده است. روش اول جواب معادله را به صورت متقارن و روش دوم جواب معادله را به صورت پادمتقارن ارائه می دهد. تعدادی مثال های عددی را با...
BACKGROUND Physiological stressors may alter susceptibility of the host intestinal epithelium to infection by enteric pathogens. In the current study, cytotoxic effect, adhesion and invasion of Salmonella enterica serovar Typhimurium (S. Typhimurium) to Caco-2 cells exposed to thermal stress (41 degrees C, 1 h) was investigated. Probiotic bacteria have been shown to reduce interaction of pathog...
We investigate the role of large amplitude sub-critical thermal fluctuations in the dynamics of first order phase transitions. In particular, we obtain a kinetic equation for the number density of sub-critical fluctuations of the broken-symmetric phase within the symmetric phase, modeled as spherical bubbles, and solve it analytically for temperatures above the critical temperature. We study th...
The thermal cycling stress method is popularly used to study the thermal mechanical effect on metallization films in VLSI applications, specially in interconnect systems of power IC. The fast thermal cycling stress method reported in this paper has several advantages compared with using a conventional oven for thermal stress. A special test chip is designed to demonstrate the application of thi...
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