In this paper, wire electric discharge machining (WEDM) of Titanium alloy (Ti-4.5Al-2V) is studied. In WEDM, the prime objective in cutting operation is to achieve the highest possible cutting speed along with desirable surface finish without sacrificing productivity. It is evident that a high material removal rate and a very good surface finish can never be achieved simultaneously in WEDM. Sel...

This paper presents a self-actuating biosensor based on the piezoelectric cantilever optimized by Taguchi method for the label-free detection of specific biomoleculars. Until now, even though the optimisation of the cantilever-based biosensors have been performed by changing dimensions one by one, few researches have performed the geometric optimisation considering the overall configuration of ...

This paper presents the multiple response optimization of end milling parameter using grey based taguchi method. Experiments were designed and conducted based on L27 orthogonal array design The milling parameter were spindle speed, depth of cut, feed rate and pressurized coolant jet and the response was surface roughness. EN31, high carbon alloy steel which achieves a high degree of hardness an...

Taguchi Method is a statistical approach to optimize the process parameters and improve the quality of components that are manufactured. The objective of this study is to illustrate the procedure adopted in using Taguchi Method to a lathe facing operation. The orthogonal array, signal-to-noise ratio, and the analysis of variance are employed to study the performance characteristics on facing op...

In this paper, fuzzy logic integrated with the Taguchi method is used to optimize Wire Electro Discharge Machining (WEDM) process with multiple quality characteristics. Rough machining with EDM gives poor surface finish and has micro cracks and pores. Finish machining gives better surface finish but with very poor machining speed (MRR). Spark gap width is one of the important performance measur...

Solder paste is the main soldering material used to form strong solder joints between printed circuit boards (PCB) and surface mount devices in the surface mount assembly (SMA). On average 60% of endof-line soldering defects can be attributed to inadequate performance of solder paste stencil printing. Recently, lead-free solder paste has been adopted by electronics manufacturers in compliance w...

In software development, comprehensive software reviews and testings are important activities to preserve high quality and to control maintenance cost. However it would be actually difficult to perform comprehensive software reviews and testings because of a lot of components, a lack of manpower and other realistic restrictions. To improve performances of reviews and testings in object-oriented...

This study proposes twooptimizationmathematicalmodels for the clustering and selection of suppliers. Model 1 performs an analysis of supplier clusters, according to customer demand attributes, including production cost, product quality and production time. Model 2 uses the supplier cluster obtained in Model 1 to determine the appropriate supplier combinations. The study additionally proposes a ...

In this study, the Taguchi method was used to optimize the effect of HALO structure or halo implant variations on threshold voltage (VTH) and leakage current (ILeak) in 45nm p-type Metal Oxide Semiconductor Field Effect Transistors (MOSFETs) device. Besides halo implant dose, the other process parameters which used were Source/Drain (S/D) implant dose, oxide growth temperature and silicide anne...