Title of Document: AN ANALYTICAL MODEL FOR DEVELOPING A CANARY DEVICE TO PREDICT SOLDER JOINT FATIGUE FAILURE UNDER THERMAL CYCLING CONDITIONS Sony Mathew, Ph.D., 2015 Directed By: Professor Michael G. Pecht , Department of Mechanical Engineering Solder joint fatigue failure is a prevalent failure mechanism for electronics subjected to thermal cycling loads. The failure is attributed to the the...

It has been suggested that the epoxy paint used to coat metal substrates in industrial electrostatic painting applications could also be used to mask metal clasps in removable dental prostheses (RDP). The purpose of this study was to evaluate both the influence of thermal cycling and the in vitro roughness of a surface after application of epoxy paint, as well as to assess the micromorphology o...

ABSTRACT I review the image stability tests performed during the second thermal-vacuum (TV) campaign of WFC3. In the first TV campaign, significant drifts were seen in both channels in response to induced thermal changes in the instrument, but subsequent analysis indicated that the induced temperature variations were unrealistically large (compared to on-orbit conditions). In the current tests,...

In hybrid electrical vehicles (HEV) the battery, motor and inverter are the core elements of the electric drive train. In the inverter power semiconductors, usually packaged in a module, are used. To qualify such power modules for the use in HEV amongst others Power cycling and Thermal cycling tests have to be performed. These tests mainly ensure the reliability of the module regarding thermal ...

During thermal cycling through the a–b phase transformation under the action of a small external biasing stress, Ti alloys exhibit an average deformation stress exponent of unity and achieve superplastic strains. We report tensile experiments on Ti–6Al–4V with an applied stress of 4.5 MPa, aimed at understanding the failure processes during transformation superplasticity. The development of cav...

The success of the high temperature power electronic applications depends on the power device reliability. The increasing thermal demands, like in hybrid electric cars, require power devices operating at junction temperatures above their common level of 125 C. The thermal cycles generated in standard modules in such conditions induce several failure mechanisms in their package and chips. This a...

A self-contained, integrated, disposable, sample-to-answer, polycarbonate microfluidic cassette for nucleic acid-based detection of pathogens at the point of care was designed, constructed, and tested. The cassette comprises on-chip sample lysis, nucleic acid isolation, enzymatic amplification (polymerase chain reaction and, when needed, reverse transcription), amplicon labeling, and detection....

It is known that two-way memory effect (TWME) can be obtained in shape memory alloys by various types of thermomechanical cycling (training). Although much uncertainty still exists on the physical origin of the TWME, it is well recognised that dislocation arrays developed during training can have an important influence on the TWME. The investigation presented in this paper was designed to provi...