INTRODUCTION ADHESIVE DENTISTRY • Indications for Use of Adhesives • Advantages of Bonding Techniques • Mechanism of Adhesion • Factors Affecting Adhesion ENAMEL BONDING • Steps for Enamel Bonding • Mechanism of Etching DENTIN BONDING • Conditioning of Dentin • Priming of Dentin • Moist vs Dry Dentin DENTIN BONDING AGENT • Mechanism of Bonding • Evolution of Dentin Bonding Agents • Nanofilled B...

objectives: this study aimed to determine the effect of surface treatments such as tooth reduction and extending the etching time on microtensile bond strength (µtbs) of composite resin to normal and fluorotic enamel after microabrasion. materials and methods: fifty non-carious anterior teeth were classified into two groups of normal and fluorotic (n=25) using thylstrup and fejerskov index (tfi...

Process optimization of BCB polymer to silicon oxide bonding was investigated. The suitable bonding temperature is about 300 C, while bond failure of BCB-to-oxide bonding is observed starting from 400 C. Bonding interface morphologies and bond strengths of BCB-to-oxide bonding were investigated as well. PECVD oxide to BCB bonding has better bonding quality than that of thermal oxide to BCB bond...

The basic assumption in the traditional inventory model is that all outputs are perfect items. However, this assumption is too simplistic in the most real-life situations due to a natural phenomenon in a production process. From this it is deduced that the system produces non-perfects items which can be classified into four groups of perfect, imperfect, reworkable defective and non-reworkable d...

The effect of imperfect production processes on lot sizing decisions received a lot of attention in the literature. These efforts have been almost confined to single stage production systems. The issue of imperfect production processes has not been adequately addressed in the context of multistage production/inventory systems. In this paper, we propose a two-stage production inventory model tha...

This paper considers a modified empirical likelihood and uses it to estimate models with imperfect moment restrictions. Consistency, local normality and asymptotic optimality of the new estimator only require the local identifiability and the linear-quadratic representation. In imperfect situations, classical sandwich algorithms give bias estimations while the new estimator preserves its asympt...

By MEMS packaging test platform for bonding process of bonding temperature and bonding time, and test silicon specifications experimental study. Experimental results indicate that when the bonding voltage of 1200V, bonding temperature of 445 0 C to 455 0 C, bonding time is 60s, the void fraction is less than 5%. Glass and silicon wafer bonding quality can achieve the best. The experimental resu...