نتایج جستجو برای: semiconductor process modelling

تعداد نتایج: 1498214  

پایان نامه :وزارت علوم، تحقیقات و فناوری - دانشگاه رازی - دانشکده علوم 1387

boron nitride semiconducting zigzag swcnt, $b_{cb}$$n_{cn}$$c_{1-cb-cn}$, as a potential candidate for making nanoelectronic devices was examined. in contrast to the previous dft calculations, wherein just one boron and nitrogen doping configuration have been considered, here for the average over all possible configurations, density of states (dos) was calculated in terms of boron and nitrogen ...

پایان نامه :وزارت علوم، تحقیقات و فناوری - دانشگاه شهید بهشتی - دانشکده علوم 1387

چکیده ندارد.

Journal: :IEE Proceedings - Circuits, Devices and Systems 2005

Journal: :international journal of nano dimension 0
z. yaghoubi industrial engineering faculty, islamic azad university, south tehran branch, tehran, iran. k. motevalli applied chemistry department, basic sciences faculty ,islamic azad university, south tehran branch, tehran, iran.

nanoparticles classified in 4 overall groups containing: metallic nanoparticles, ceramic nanoparticles, polymeric nanoparticles and semiconductor nanoparticles. these nanoparticles are used in some biomedical applications such as carrying medicine and photographing agents. with attention to different criteria which are both qualitative and quantitative, selecting the most suitable nanoparticles...

2013
Niels Müller-Wickop Martin Schultz

It is widely acknowledged that a comprehensive understanding of business processes is crucial for an effective and efficient audit of a company’s financial reporting and regulatory compliance, especially in light of the recent major financial scandals. In an attempt to improve the support of business process auditors, we conducted 17 semi-structured expert interviews to obtain deeper insights i...

2010
Shane Lynn John Ringwood Niall MacGearailt

Plasma etch is a complex semiconductor manufacturing process in which material is removed from the surface of a silicon wafer using a gas in plasma form. As the process etch rate cannot be measured easily during or after processing, virtual metrology is employed to predict the etch rate instantly using ancillary process variables. Virtual metrology is the prediction of metrology variables using...

Journal: :Bulletin of the Japan Institute of Metals 1992

Journal: :CoRR 2007
Donald Sofge

The SEMATECH sponsored J-88-E project teaming Texas Instruments with NeuroDyne (et al) focused on Fault Detection and Classification (FDC) on a Lam 9600 aluminum plasma etch reactor, used in the process of semiconductor fabrication. Fault classification was accomplished by implementing a series of virtual sensor models which used data from real sensors (Lam Station sensors, Optical Emission Spe...

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