The fin efficiency of a high-thermal-conductivity substrate coated with a low-thermalconductivity layer is considered, and an analytical solution is presented and compared to alternative approaches for calculating fin efficiency. This model is appropriate for frost formation on a round-tube-and-fin metallic heat exchanger, and the problem can be cast as conduction in a composite two-dimensional...

Silicon carbide (SiC) is a wide band gap material that shows great promise in high-power and high temperature electronics applications because of its high thermalconductivity and high breakdown electrical field. This paper describes how the outstanding physical andelectronic properties ofSiC permit the fabrication of devices that can operate athigher temperature and power levels than devices fa...

has been developing III-nitride double heterostructures (DHs) with indium gallium nitride (InGaN) channels with a view to high-electron-mobility transistors (HEMTs) [Yi Zhao et al, Appl. Phys. Lett., vol105, p223511, 2014]. The resulting structures boast the highest reported mobility for InGaN channels and superior transport at high temperature, according to the research team. Nitride semicondu...

The effect of temperature and moisture content on the thermal properties such as thermal conductivity, specific heat andbulk thermal diffusivity was evaluated. The thermal conductivity was measured by the transient technique using a line heat source. The maximum slope method was used to analyse the line source heating data for thermal conductivity determination. The specific heat capacity was m...

In this paper, a new open-source library of fluid power models is introduced. The intent of the library is to formally collect knowledge about fluid power components and systems, and to share and communicate this knowledge openly among the members of the fluid power community. The library takes advantage of the object-oriented features of the Modelica language to formulate the models in a forma...