Advances in catheter-based interventions in structural and congenital heart disease have mandated an increased demand for three-dimensional (3D) visualisation of complex cardiac anatomy. Despite progress in 3D imaging modalities, the pre- and periprocedural visualisation of spatial anatomy is relegated to two-dimensional flat screen representations. 3D printing is an evolving technology based o...

In this study, three-dimensional simulations are presented for laminar forced convection flow of a radiating gas over a backward-facing step in rectangular duct. The fluid is treated as a gray, absorbing, emitting and scattering medium. The three-dimensional Cartesian coordinate system is used to solve the governing equations which are conservations of mass, momentum and energy. These equations...

Numerous techniques in designing zones happen at high temperature and functions under high temperature are in a way that involves non-linear radiation. In weakly conducting fluids, however, the currents induced by an external magnetic field alone are too small, and an external electric field must be applied to achieve an efficient flow control. Gailitis and Lielausis, devised Riga plate to gene...

in this paper, experimentally derived correlations of heat transfer and pressure drop are used in a pareto based multi-objective optimization (moo) approach to find the best possible combinations of heat transfer and pressure drop of tio2-water nanofluid flow in tubes fitted with multiple twisted tape inserts in different arrangement. in this study there are four independent design variables: t...

The present paper deals with the prediction of three-dimensional fluid flow and heat transfer in rib-roughened ducts of square cross-section. Such flows are of direct relevance to the internal cooling system of modern gas turbine blades. The main objective is to assess how a recently developed variant of a cubic non-linear model (proposed by Craft et al. (1999)), that has been shown to produce ...

There are numerous process integration schemes currently in place for the implementation of 3D-IC. Via first, via middle, via last along with back end of line (BEOL), front end of line (FEOL) and other variations of these approaches. This work will explore the role of wafer bonding, both permanent and temporary, in the fabrication of 3D-IC. Additionally, the materials and process flows used for...