نتایج جستجو برای: top-module

تعداد نتایج: 190981  

Journal: :bulletin of the iranian mathematical society 2011
m. behboodi m. j. noori

Let (R,m) be a Noetherian local ring, M be a finitely generated R-module of dimension n and a be an ideal of R. In this paper, generalizing the main results of Dibaei and Jafari [3] and Rezaei [8], we will show that if T is a subset of AsshR M, then there exists an ideal a of R such that AttR Hna (M)=T. As an application, we give some relationships between top local cohomology modules and top f...

پایان نامه :وزارت علوم، تحقیقات و فناوری - دانشگاه شیراز - دانشکده علوم 1390

throughout this dissertation r is a commutative ring with identity and m is a unitary r-module. in this dissertation we investigate submodules of multiplication , prufer and dedekind modules. we also stat the equivalent conditions for which is ring , wher l is a submodule of afaithful multiplication prufer module. we introduce the concept of integrally closed modules and show that faithful mu...

Journal: :International Journal of Photoenergy 2020

Journal: :Linear Algebra and its Applications 2010

1997
Qiang Wang David M. Lewis

This paper describes a compiler that generates both hardware and controlling software for eld-programmable compute accelerators. By analyzing a source program together with part of its input, the compiler generates VHDL descriptions of functional units that are mapped on a set of FPGA chips and an optimized sequence of control instructions that run on the customized machine. The primary techniq...

Journal: :Journal of Navigation and Port Research 2011

2001
S. Zimmermann G. Cardoso J. Andresen J. A. Appel G. Chiodini D. C. Christian B. K. Hall J. Hoff S. W. Kwan A. Mekkaoui R. Yarema

At Fermilab, a pixel detector multichip module is being developed for the BTeV experiment. The module is composed of three layers. The lowest layer is formed by the readout integrated circuits (ICs). The back of the ICs is in thermal contact with the supporting structure, while the top is flip-chip bump-bonded to the pixel sensor. A low mass flex-circuit interconnect is glued on the top of this...

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