Functionally graded materials are commonly used in thermal environment to change the properties of constituent materials. The new numerical procedure of functionally graded skew plates in thermal environment is presented in this study based on the C0-form of the novel third-order shear deformation theory. Without the shear correction factor, this theory is also taking the desirable properties and advantages of the third-order shear deformation theory. We assume that the uniform distribution of temperature is embedded across the thickness of this structure. Both the rule of mixture and the micromechanics approaches are considered to describe the variation of material compositions across the thickness. Numerical solutions and comparison with other available solutions suggest that this procedure based on novel third-order shear deformation theory is accuracy and efficiency.