Deposition of a coating on rough surfaces faces unique challenges due to the complexity substrate morphology. In present research, electroless deposition Ni-P was successfully deposited diamond particles. Microtomography conducted study mechanisms. It revealed that coverage rate particles affected by synergistic action time, morphology, and hypophosphite concentration. The best achieved in solu...

In the present work copper/diamond composites, such as (Cu-10 Vf % diamond uncoated, Cu-30 Vf % diamond uncoated, Cu-10 Vf % diamond coated NiCrB and Cu-30 Vf % coated NiCrB) as heat sink materials have been fabricated using powder metallurgy and electroless techniques. The copper powder used in this study has been fabricated using electroless technique and the diamond powder was electroless co...

In this study, UBM material systems for flip chip solder bumps on Cu pads were investigated using the electroless copper (E-Cu) and electroless nickel (E-Ni) plating methods; and the effects of the interfacial reaction between UBMs and Sn–36Pb–2Ag solders on the solder bump joint reliability were also investigated to optimize UBM materials for flip chip on Cu pads. For the E-Cu UBM, scallop-lik...

Ultra-thin diamond-like carbon (DLC) coatings are used in precision engineering applications, such as magnetic storage devices, to protect intricate structures from wear and corrosion. A DLC coating typically consists of hard amorphous carbon in combination with an interlayer such as silicon (Si), to improve adhesion to the substrate material. Deformation and delamination of these coatings, eve...

Metallic glasses (MGs) are notorious for the poor macroscopic ductility and to overcome the weakness various intrinsic and extrinsic strategies have been proposed in past decades. Among them, the metal coating is regarded as a flexible and facile approach, yet the physical origin is poorly understood due to the complex nature of shear banding process. Here, we studied the origin of ductile enha...

This thesis presents the low cost process for UBM formation on aluminum pads of single die/dice for Flip Chip applications. The UBM (Under Bump Metallization) is required in solder bump structure to provide adhesion/diffusion barrier layer, solder wettable layer, and oxidation barrier layer between the bonding pads of the die and the bumps. Typically, UBM is deposited on the whole wafers by spu...

the corrosion protection of mild steel by a newly developed epoxy-based coating system containing inherently conducting nanopolyaniline-clay as a nanoadditive has been studied. polyaniline-clay anticorrosion nanoadditive (pcna) was obtained by the direct mixing method of nanopolyaniline (0.03 wt.%) and organo-modified clay (3 wt.%) at atmospheric pressure, and xrd technique was used to study d-...