We show that the optimal prize structure of symmetric n-player Tullock tournaments assigns the entire prize pool to the winner, provided that a symmetric pure strategy equilibrium exists. If such an equilibrium fails to exist under the winner-take-all structure, we construct the optimal prize structure which improves existence conditions by dampening efforts. If no such optimal equilibrium exis...

and Applied Analysis 3 For the rest of the paper we need the following assumption: C3 0 < ∑m−2 i 1 αiφ1 ηi < 1. Lemma 2.2 see 1 . Assuming that (C2) and (C3) hold. Let y ∈ C ρ 0 , σ 1 . Then boundary value problem xΔ∇ t a t xΔ t b t x t y t 0, t ∈ 0, 1 T , x ( ρ 0 ) 0, x σ 1 m−2 ∑ i 1 αix ( ηi ) 2.3 is equivalent to integral equation

A fully 3D conjugate numerical analysis was performed to reveal the effects of air, R134a refrigerant and water on electromagnetic fields of electronic cooling designs made of arrays of micro pin-fins with integrated ThroughSilicon-Vias (TSVs). The integrated TSV cooling configuration included 8 cylindrical TSVs with 150 μm diameter each and 200 μm height. The external dimensions of the silicon...

3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between processing cores, and an effective way to diminish this impact on communication is the 3D integration technology and the use of through-silicon vias (TSVs) for inter-layer communication. However, 3D chips present imp...

We explore the relationship between the choice of the strategy space and outcomes in Tullock contests. In particular, in a framework where one of the contest’s participants moves …rst, we show that there is an equilibrium where this individual wins the contest with probability one. We also show that not only the nature of the outcome changes (e.g., who wins the contest) with the choice of the s...

We have analyzed the stress build-up and vacancy dynamics due to material transport caused by electromigration in dual-damascene interconnect structures. Our model incorporates all relevant driving forces for material transport with a complete integration of mechanical stress in connection with microstructural aspects. First, it is shown that the addition of redundant vias can be effective in i...