In this work, we investigate the effects of numerical dispersion in the finite-difference time-domain (FDTD) algorithm for layered, anisotropic media. We first derive numerical dispersion relations for diagonally anisotropic media (corresponding to an FDTD reference frame coinciding with the principal axes of a biaxial media). In addition, we incorporate the discretization effects on the reflec...

Flip chip interconnections using anisotropic conductive film (ACF) are now a very attractive technique for electronic packaging assembly. Although ACF is environmentally friendly, many factors may influence the reliability of the final ACF joint. External mechanical loading is one of these factors. Finite element analysis (FEA) was carried out to understand the effect of mechanical loading on t...

In a flip-chip-on-glass (FCOG) assembly, anisotropic conductive film (ACF) is used as the adhesive to bind the desired interconnection between the flip chip and glass substrate. However, it remains a challenge to develop the ACF bonded flip chip packages with low contact resistance. Considerable research has been conducted recently to investigate the effect of different parameters on the contac...

Recently the physics of ballistic phonon propagation in anisotropic crystals has been studied with new phonon-imaging methods. In this paper we consider nondiffracting waves that can propagate in anisotropic crystals and analyze their properties that emerge specifically due to the anisotropy. We further present a detailed generation and detection scheme for the experimental verification of the ...