bracing is the non-operative treatment of choice for adolescent idiopathic scoliosis (ais) and careful application of pads on apical segment of curve is very important for correction. control of pads` appropriate site in brace is not easy by clinical evaluation. therefore, we decided to compare results of braces which for better control of pads by radiographs, metal marker inserted around pads ...

Objective: To evaluate the shear bond strength of lingual orthodontic brackets with resin or metal pads, the location of bond failure and the adhesive remnant index (ARI). Methods: A total of 40 extracted upper premolars were randomly divided into two groups of 20 each: bonding with brackets having (1) pads with extended resin directly on the lingual surface of teeth, and (2) pads with metal...

This paper presents an area pad layout method to e ciently reduce the space required for interconnection pads and pad drivers. Unlike peripheral pads, area pads use only the top metal layer and therefore allow active circuitry to be laid out underneath. With identical functional elements grouped together, a group of pad drivers share the same well and can be placed tightly together. The use of ...

BACKGROUND Patients with prominent periorbital fat pads often complain of having a persistent "tired" look and seek treatment from their dermatologist. OBJECTIVE A non-surgical treatment of fat pads. METHODS Thirty patients were treated for prominent lower eyelid fat pads with phosphatidylcholine injection. Pre- and posttreatment photographs were taken for long-term analysis. RESULTS A ma...

A direct and metal layer-free growth of flat graphene pads on exfoliated hexagonal boron nitride substrate (h-BN) are demonstrated by atmospheric chemical vapour deposition (CVD) process. Round shape with high flatness graphene pads are grown in high yield (∼95%) with a pad thickness of ∼0.5 nm and homogenous diameter.

To save layout area for electrostatic discharge (ESD) protection design in the SOC era, test chip with large size NMOS devices placed under bond pads has been fabricated in 0.35-μm one-poly-four-metal (1P4M) 3.3V CMOS process for verification. The bond pads had been drawn with different layout patterns on the inter-layer metals to investigate the effect of bonding stress on the active devices u...

This paper proposed an efficient reduction method of voltage drop (IR) at the core of high density IC’s chips. The presented method is based on branching out several layer of metals from the I/O bond-pads of power supply and feed them to the core of the chip through a data and other non power supply pads. Hence, the up most two layers of metals (M6, M7) for seven layers of metals technology are...

Ultra-long metal nanowire arrays with large circular area up to 25 mm in diameter were obtained by direct electrodeposition on metalized Si and glass substrates via a template-based method. Nanowires with uniform length up to 30 μm were obtained. Combining this deposition process with lithography technology, micrometre-sized patterned metal nanowire array pads were successfully fabricated on a ...

The system of electrons trapped in vacuum above the liquid helium surface displays the highest mobilities known in condensed matter physics. We provide a brief summary of the experimental and theoretical results obtained for this system. We then show that a quasi-2D set of N > 10 electrons in vacuum trapped in 1D hydrogenic levels above a micron-thick helium film can be used as an easily manipu...