Test planning for core-based 3D stacked ICs with trough-silicon vias (3D TSV-SIC) is different from test planning for non-stacked ICs as the same test schedule cannot be applied both at wafer sort and package test. In this paper, we assume a test flow where each chip is tested individually at wafer sort and jointly at package test. We define cost functions and test planning optimization algorit...

Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

delayed-type hypersensitivity (dth) reaction measured by skin testing is an important indicator for evaluation of cellular immune response in leishmaniasis. skin testing in leishmaniasis, known as leishmanin or montenegro test, is used normally for immunoepidemiological studies and for diagnosis. in cutaneous leishmaniasis (cl), the skin test is positive during the active phase of disease and r...

This article considers the phenomenon of online body display by users of social networking sites in Hong Kong. A survey of 392 young adults was conducted to investigate the relationships between narcissism, grandiose exhibitionism, body image satisfaction, perceived privacy risks, and online body display. A Body Display Index was developed to measure the perceived level of sexual explicitness o...

In the race against Moores Law, integrated chips (ICs) with multiple dies stacked over one another and connected by ThroughSilicon Vias (TSVs), called 3D TSV-Stacked ICs (SICs) have attracted a fair amount of research [1]–[5]. Due to imperfections in IC manufacturing, each individual chip must be tested. Testing each IC, increases cost, which is highly related to the testing time spent on each ...