نتایج جستجو برای: through three sections

تعداد نتایج: 2532035  

پایان نامه :دانشگاه تربیت معلم - تهران - دانشکده ادبیات و علوم انسانی 1392

in this study, the relationship between teachers’ creative and critical thinking skills and their reflectivity in teaching was investigated. to this end, three questions were raised. these questions were intended to determine whether there was a significant relationship between teachers’ creative thinking skills and their reflectivity in teaching; whether there was a significant relationship be...

2017
Joohee Kim Jun So Pak Joungho Kim

3D IC is emerging as a powerful solution for the next-generation system packaging and integration technology to achieve low power consumption, high channel bandwidth and high density integration capability simultaneously. As for the vertical interconnect for a 3D IC, through-silicon via (TSV) is a key component which can provide a significant performance improvement with greatly reduced physica...

Journal: :IJUC 2005
James M. Greenberg Curtis Greene S. P. Hastings

The purpose of this brief note is to call attention to a theorem published almost twenty-…ve years ago [GGH] on two dimensional cellular automata which we believe is still of interest, but which seems to be very little known. One reason for this obscurity may be that when we wrote this paper, we did not know the term " cellular automata " , and so it does not appear in the title or elsewhere in...

Journal: :J. Electronic Testing 2015
Nima Aghaee Zebo Peng Petru Eles

In a modern three-dimensional integrated circuit (3D IC), vertically stacked dies are interconnected using through silicon vias. 3D ICs are subject to undesirable temperature-cycling phenomena such as through silicon via protrusion as well as void formation and growth. These cycling effects that occur during early life result in opens, resistive opens, and stress induced carrier mobility reduct...

Journal: :Microelectronics Reliability 2013
K. N. Tu Hsiang-Yao Hsiao Chih Chen

As microelectronic industry develops 3D IC on the basis of through-Si-vias (TSV) technology, the processing and reliability of microbumps, which are used to interconnect the stacking chips, is being actively investigated. Due to the reduction in size of microbumps, the diameter is about one order of magnitude smaller than that of flip chip solder joints, and the volume is 1000 times smaller. It...

پایان نامه :وزارت علوم، تحقیقات و فناوری - دانشگاه پیام نور - دانشگاه پیام نور مرکز - دانشکده زبانهای خارجی 1391

the primary goal of the current project was to examine the effect of three different treatments, namely, models with explicit instruction, models with implicit instruction, and models alone on differences between the three groups of subjects in the use of the elements of argument structures in terms of toulmins (2003) model (i.e., claim, data, counterargument claim, counterargument data, rebutt...

پایان نامه :وزارت علوم، تحقیقات و فناوری - دانشگاه فردوسی مشهد - دانشکده ادبیات و علوم انسانی دکتر علی شریعتی 1392

today, information technology and computers are indispensable tools of any profession and translation technologies have become an indispensable part of translator’s workstation. with the increasing demands for high productivity and speed as well as consistency and with the rise of new demands for translation and localization, it is necessary for translators to be familiar with market demands an...

پایان نامه :وزارت علوم، تحقیقات و فناوری - دانشگاه تربیت دبیر شهید رجایی - دانشکده علوم انسانی 1393

according to research, academic self-concept and academic achievement are mutually interdependent. in the present study, the aim was to determine the relationship between the academic self-concept and the academic achievement of students in english as a foreign language and general subjects. the participants were 320 students studying in 4th grade of high school in three cities of noor, nowshah...

پایان نامه :دانشگاه تربیت معلم - تهران - دانشکده ادبیات و علوم انسانی 1393

abstract target-oriented approaches to translation studies are regarded as recent theories of translation. one of the most famous theories among these approaches is descriptive translation studies presented by toury (1995). this theory gives a new dimension to translation studies and gives importance to the descriptive rather than prescriptive studies. it also identifies three sets of transla...

نمودار تعداد نتایج جستجو در هر سال

با کلیک روی نمودار نتایج را به سال انتشار فیلتر کنید